Concepedia

Isamu Koshiyama

IK

4

Publications

133

Citations

4

H-Index

2004

Active since

Affiliations

Fuji Machine (Japan)(Current)

University of Arizona

Isamu Koshiyama is an author at Fuji Machine (Japan) specializing in engineering, materials science, and mechanical engineering.

Top concepts

EngineeringMaterial ScienceCorrosionMechanical EngineeringMicrostructureApplied PhysicsSurface ScienceChemical EngineeringMaterials EngineeringEnvironmental Engineering

Publications per year

2004–2012

4

Publications

4

Determining the Effects of Slurry Surfactant, Abrasive Size, and Abrasive Content on the Tribology and Kinetics of Copper CMP

Z. Li, K. Ina, Paul G. LeFevre et al. · Journal of The Electrochemical Society · 2005 · 58 citations

Materials Science, Copper Cmp, Chemical Engineering +15

Effect of Slurry Flow Rate on Tribological, Thermal, and Removal Rate Attributes of Copper CMP

Z. Li, L. Borucki, Isamu Koshiyama et al. · Journal of The Electrochemical Society · 2004 · 51 citations

Slurry Flow Rate, Engineering, Mechanical Engineering +22

High precision chemical mechanical polishing of highly-boron-doped Si wafer used for epitaxial substrate

Junji Watanabe, Guolin Yu, Osamu Eryu et al. · Precision Engineering · 2004 · 14 citations

Materials Engineering, Materials Science, Wafer Scale Processing +9

Effects of Atmosphere and Ultraviolet Light Irradiation on Chemical Mechanical Polishing Characteristics of SiC Wafers

Osamu Ohnishi, Toshiro Doi, Syuhei KUROKAWA et al. · Japanese Journal of Applied Physics · 2012 · 10 citations

Materials Science, Materials Engineering, Sic Wafers +15

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