Concepedia

Lim Pei Siang Sharon

LP

Statistics

Publications

2

Citations

138

H-Index

2

Active since

2016

Affiliations

Institute of Microelectronics(Current)

Agency for Science, Technology and Research

Lim Pei Siang Sharon is an author at Institute of Microelectronics specializing in microfabrication, engineering, and electronic packaging.

Top concepts

3D PrintingEngineeringMicroelectronicsMicrofabricationAdvanced PackagingElectronic PackagingMechanical EngineeringMicrostructureApplied PhysicsMaterial Science

Publications per year

2016–2018

2

Publications

2

Development of High Density Fan Out Wafer Level Package (HD FOWLP) with Multi-layer Fine Pitch RDL for Mobile Applications

Vempati Srinivasa Rao, Chai Tai Chong, David Ho et al. · 2016 · 125 citations

Engineering, Mechanical Engineering, Conventional Fowlp Technology +17

Comprehensive study on die shift and die protrusion issues during molding process of Mold-1st FOWLP

Simon Siak Boon Lim, Ser Choong Chong, Lim Pei Siang Sharon et al. · 2018 · 13 citations

Mold Control, Engineering, Die Protrusion Issues +20

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