Wei Feng

Investigation of switching mechanism in HfOx-ReRAM under low power and conventional operation modes

Wei Feng, Hisashi Shima, Kenji Ohmori et al. · Scientific Reports · 2016 · 35 citations · Full text

Engineering, Materials Engineering, Materials Science +17

Validation of TSV thermo-mechanical simulation by stress measurement

Wei Feng, Naoya Watanabe, H. Shimamoto et al. · Microelectronics Reliability · 2016 · 18 citations

Engineering, Materials Engineering, Materials Science +14

Methods to reduce thermal stress for TSV Scaling ∼TSV with novel structure: Annular-Trench-Isolated TSV

Wei Feng, Naoya Watanabe, H. Shimamoto et al. · 2015 · 17 citations

Engineering, Electrical Engineering, Materials Science +17

Fabrication and stress analysis of annular-trench-isolated TSV

Wei Feng, Tung Thanh Bui, Naoya Watanabe et al. · Microelectronics Reliability · 2016 · 15 citations

Natural Sciences, Materials Science, Packaging Design +2

Analysis of thermal stress distribution for TSV with novel structure

Wei Feng, Naoya Watanabe, H. Shimamoto et al. · 2014 · 14 citations

Engineering, Electrical Engineering, Materials Science +17