Dieter Pierreux

High-k dielectrics for future generation memory devices (Invited Paper)

J. A. Kittl, Karl Opsomer, M. Popovici et al. · Microelectronic Engineering · 2009 · 246 citations

Electrical Engineering, Semiconductor Device, Engineering +7

Influence of the Oxidant on the Chemical and Field-Effect Passivation of Si by ALD Al[sub 2]O[sub 3]

G. Dingemans, N. M. Terlinden, Dieter Pierreux et al. · Electrochemical and Solid-State Letters · 2010 · 162 citations · Full text

Plasma-Assisted ALD for the Conformal Deposition of SiO₂: Process, Material and Electronic Properties

G. Dingemans, Cristian A. A. van Helvoirt, Dieter Pierreux et al. · Journal of The Electrochemical Society · 2012 · 143 citations · Full text

Batch ALD: Characteristics, comparison with single wafer ALD, and examples

Ernst Granneman, Pamela R. Fischer, Dieter Pierreux et al. · Surface and Coatings Technology · 2007 · 116 citations

Aluminium Nitride, Electrical Engineering, Wafer Scale Processing +6

Atomic Layer Deposition of Strontium Titanate Films Using Sr([sup t]Bu[sub 3]Cp)[sub 2] and Ti(OMe)[sub 4]

M. Popovici, Sven Van Elshocht, N. Menou et al. · Journal of The Electrochemical Society · 2009 · 61 citations

Engineering, Thin Film Process Technology, Chemical Deposition +17