H. Engelmann - Concepedia

Author

H. Engelmann

Also Known As

H J Engelmann, H. -J. Engelmann, H. ENGELMANN, H. Engelmann, H. J. Engelmann, H.-J Engelmann, H.-J. Engelmann, H.J. Engelmann, H.‐J. Engelmann, Hans Engelmann

Publications

1.1K

Citations

H-Index

Concepts

All Affiliations

Saarland University Leibniz Institute for Solid State and Materials Research Technische Universität Dresden Nanyang Technological University Advanced Micro Devices (Canada)

About

H. Engelmann is an author at Saarland University specializing in engineering, applied physics, and materials science.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	16	22	942
2	Applied Physics	13	18	678
3	Natural Sciences	4	4	372
4	Biochemistry	1	1	64
5	Chemical Engineering	1	1	27

H. Engelmann

Publications

953

Citations

H-Index

Page 1

	Year	Citations
Photorefractive centers in LiNbO3, studied by optical-, Mössbauer- and EPR-methods H. Kurz, E. Krätzia, W. Keune, Applied Physics A Optical MaterialsEngineeringPhysicsOptical PropertiesSpectroscopy	1977	272
Microstrip-A New Transmission Technique for the Klilomegacycle Range D.D. Grieg, H. Engelmann Proceedings of the IRE Electrical EngineeringEngineeringRadio FrequencyMicrowave TransmissionAntenna	1952	112
Structure and thermal stability of graded Ta–TaN diffusion barriers between Cu and SiO2 René Hübner, M. Hecker, N. Mattern, Thin Solid Films Materials EngineeringMaterials ScienceMaterial AnalysisEngineeringDiffusion Resistance	2003	67
Investigation of Large Intramolecular Movements within Metmyoglobin by Rayleigh Scattering of Mössbauer Radiation (RSMR) Yu. F. Krupyanskiǐ, F. Parak, V.I. Goldanskii, Zeitschrift für Naturforschung C EngineeringWater VaporActive FluidLangevin EquationSoft Matter	1982	64
Integration and optimization of embedded-sige, compressive and tensile stressed liner films, and stress memorization in advanced SOI CMOS technologies L.T. Su, John Pellerin, Shih-Fen Huang, EngineeringVlsi DesignSilicon On InsulatorInterconnect (Integrated Circuits)Advanced Packaging (Semiconductors)	2005	63
Influence of nitrogen content on the crystallization behavior of thin Ta–Si–N diffusion barriers René Hübner, M. Hecker, N. Mattern, Thin Solid Films Materials ScienceMaterial AnalysisEngineeringDiffusion ResistanceMicrostructure	2004	43
Influence of N content on microstructure and thermal stability of Ta–N thin films for Cu interconnection M. Hecker, D. Fischer, Volker Hoffmann, Thin Solid Films Materials EngineeringN ContentMaterials ScienceMaterial AnalysisEngineering	2002	34
Influence of Fe-substitution on the high-Tc superconductivity J. Jing, J. Bieg, H. Engelmann, Solid State Communications Superconducting MaterialHigh-tc SuperconductivityEngineeringPhysicsHigh-temperature Superconductivity	1988	31
Improvement of Electromigration Lifetime of Submicrometer Dual-Damascene Cu Interconnects Through Surface Engineering A. V. Vairagar, Zhenghao Gan, Wei Shao, Journal of The Electrochemical Society EngineeringCap DepositionInterconnect (Integrated Circuits)Em Lifetime ImprovementChemical Engineering	2006	27
Cobalt-silicide structures studied by Mössbauer spectroscopy I. Dézsi, H. Engelmann, U. Gonser, Hyperfine Interactions Materials ScienceEngineeringSiliceneStructure ElucidationMossbauer Spectroscopy	1987	25

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