Structure and thermal stability of graded Ta–TaN diffusion barriers between Cu and SiO2 - Concepedia

Concepedia

Publication | Closed Access

Structure and thermal stability of graded Ta–TaN diffusion barriers between Cu and SiO2

67

Citations

26

References

2003

Year

René Hübner, M. Hecker, N. Mattern, Volker Hoffmann, K. Wetzig, Christian Wenger, H. Engelmann, C. Wenzel, Ehrenfried Zschech, Johann W. Bartha

Thin Solid Films

Materials EngineeringMaterials ScienceMaterial AnalysisEngineeringDiffusion ResistanceSurface ScienceApplied PhysicsSemiconductor MaterialLayered MaterialThermal Stability

References

	Year	Citations

Page 1

Page 1