W. Oesterle

Statistics

Publications

Citations

343

H-Index

Active since

1998

Affiliations

Federal Institute For Materials Research and Testing(Current)

Fraunhofer Institute for Telecommunications, Heinrich Hertz Institute

Technical University of Denmark

Ferdinand-Braun-Institut

W. Oesterle is an author at Federal Institute For Materials Research and Testing specializing in materials engineering, materials science, and natural sciences.

Publications per year

1998–2014

Publications

Critical review of the current status of thickness measurements for ultrathin SiO <sub>2</sub> on Si Part V: Results of a CCQM pilot study

M. P. Seah, Steven J. Spencer, Farid Bensebaa et al. · Surface and Interface Analysis · 2004 · 140 citations

Engineering, Materials Engineering, Materials Science +17

Impact of counterface topography on the formation mechanisms of nanostructured tribofilm of PEEK hybrid nanocomposites

G. Zhang, Bernd Wetzel, B.C. Jim et al. · Tribology International · 2014 · 56 citations

Engineering, Materials Engineering, Materials Science +17

Oxidation and reduction kinetics of eutectic SnPb, InSn, and AuSn: a knowledge base for fluxless solder bonding applications

J.F. Kuhmann, B. Adolphi, Kenneth E. Maly et al. · IEEE Transactions on Components Packaging and Manufacturing Technology Part C · 1998 · 48 citations · Full text

Natural Sciences, Materials Engineering, Materials Science +17

Low temperature sintering of barium titanate based ceramics with high dielectric constant for LTCC applications

Hamid Naghib‐zadeh, Carsten Glitzky, W. Oesterle et al. · Journal of the European Ceramic Society · 2010 · 40 citations

Natural Sciences, Materials Engineering, Materials Science +15

Pt thin-film metallization for FC-bonding using SnPb60/40 solder bump metallurgy

J.F. Kuhmann, C.H Chiang, P. Harde et al. · Materials Science and Engineering A · 1998 · 26 citations

Natural Sciences, Materials Engineering, Materials Science +13

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