Concepedia

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Pt thin-film metallization for FC-bonding using SnPb60/40 solder bump metallurgy

DOI

26

Citations

4

References

1998

Year

J.F. Kuhmann, C.H Chiang, P. Harde, F. Reier, W. Oesterle, I. Urban, Andreas Klein
Materials Science and Engineering A

References

YearCitations

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