Concepedia

J.F. Kuhmann

JK

7

Publications

154

Citations

7

H-Index

1996

Active since

Affiliations

Technical University of Denmark(Current)

Fraunhofer Institute for Telecommunications, Heinrich Hertz Institute

Federal Institute For Materials Research and Testing

Ferdinand-Braun-Institut

Delta (Denmark)

J.F. Kuhmann is an author at Technical University of Denmark specializing in engineering, electronic packaging, and materials science.

Top concepts

Publications per year

1996–2002

7

Publications

7

Oxidation and reduction kinetics of eutectic SnPb, InSn, and AuSn: a knowledge base for fluxless solder bonding applications

J.F. Kuhmann, B. Adolphi, Kenneth E. Maly et al. · IEEE Transactions on Components Packaging and Manufacturing Technology Part C · 1998 · 48 citations

, , +17

Pt thin-film metallization for FC-bonding using SnPb60/40 solder bump metallurgy

J.F. Kuhmann, C.H Chiang, P. Harde et al. · Materials Science and Engineering A · 1998 · 26 citations

, , +9

In situ observation of the self-alignment during FC-bonding under vacuum with and without H<sub>2</sub>

J.F. Kuhmann, David Pech · IEEE Photonics Technology Letters · 1996 · 22 citations

, , +15

Oxidation and Reduction of Liquid SnPb (60/40) under Ambient and Vacuum Conditions

J.F. Kuhmann, Kenneth E. Maly, Andrea Preuß et al. · Journal of The Electrochemical Society · 1998 · 20 citations

, , +16

Flip chip mounting of laser diodes with Au/Sn solder bumps: bumping, self-alignment and laser behavior

W. Pittroff, J. Barnikow, Andreas Klein et al. · 2002 · 14 citations

, , +19

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