J. Barnikow is an author at Ferdinand-Braun-Institut specializing in electronic packaging, materials engineering, and applied physics.
Top concepts
EngineeringApplied PhysicsSurface ScienceMaterial ScienceElectronic PackagingMaterials EngineeringMicrostructureNanotechnologySolidificationOptoelectronics
Publications per year
1995–2002
2
2
Au–Sn solder bumps with tungsten silicide based barrier metallization schemes
W. Pittroff, T. Reiche, J. Barnikow et al. · Applied Physics Letters · 1995 · 14 citations
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