T. Reiche is an author at Ferdinand-Braun-Institut specializing in engineering, materials science, and materials engineering.
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EngineeringMicrostructureNanotechnologySolidificationApplied PhysicsSurface ScienceMaterial ScienceNanomanufacturingPowder MetallurgyElectronic Packaging
Publications per year
1995–1995
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Au–Sn solder bumps with tungsten silicide based barrier metallization schemes
W. Pittroff, T. Reiche, J. Barnikow et al. · Applied Physics Letters · 1995 · 14 citations
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