Behnam Khorramdel

Inkjet printing technology for increasing the I/O density of 3D TSV interposers

Behnam Khorramdel, Jessica Liljeholm, Mika-Matti Laurila et al. · Microsystems & Nanoengineering · 2017 · 36 citations · Full text

Engineering, Materials Engineering, Materials Science +14

Combination of E-Jet and Inkjet Printing for Additive Fabrication of Multilayer High-Density RDL of Silicon Interposer

Mika-Matti Laurila, Behnam Khorramdel, Matti Mäntysalo · IEEE Transactions on Electron Devices · 2017 · 30 citations

Engineering, Materials Engineering, Materials Science +12

Electrical Contacts in SOI MEMS Using Aerosol Jet Printing

Behnam Khorramdel, Altti Torkkeli, Matti Mäntysalo · IEEE Journal of the Electron Devices Society · 2017 · 21 citations · Full text

Engineering, Electrical Engineering, Materials Science +17

Fabrication and electrical characterization of partially metallized vias fabricated by inkjet

Behnam Khorramdel, Matti Mäntysalo · Journal of Micromechanics and Microengineering · 2016 · 17 citations · Full text

Engineering, Electrical Engineering, Materials Science +16

Failure Mechanisms in Flip‐Chip Bonding on Stretchable Printed Electronics

Mohammad H. Behfar, Behnam Khorramdel, Arttu Korhonen et al. · Advanced Engineering Materials · 2021 · 16 citations · Full text

Engineering, Materials Engineering, Materials Science +16