Jessica Liljeholm

Low-Loss, High-Linearity RF Interposers Enabled by Through Glass Vias

Umer Shah, Jessica Liljeholm, James Campion et al. · IEEE Microwave and Wireless Components Letters · 2018 · 45 citations · Full text

Advanced Packaging, 3D Ic Architecture, Electrical Engineering +14

Through-Glass Vias for Glass Interposers and MEMS Packaging Applications Fabricated Using Magnetic Assembly of Microscale Metal Wires

Miku J. Laakso, Simon J. Bleiker, Jessica Liljeholm et al. · IEEE Access · 2018 · 37 citations · Full text

Engineering, Interconnect (Integrated Circuits), Micro-electromechanical System +20

Inkjet printing technology for increasing the I/O density of 3D TSV interposers

Behnam Khorramdel, Jessica Liljeholm, Mika-Matti Laurila et al. · Microsystems & Nanoengineering · 2017 · 34 citations · Full text

A Micromachined Coupled-Cantilever for Piezoelectric Energy Harvesters

Agin Vyas, Henrik Staaf, Cristina Rusu et al. · Micromachines · 2018 · 14 citations · Full text

Extended Stress Distribution, Electrical Engineering, Energy Harvesting +15

High-resolution X-ray computed tomography of through silicon vias for RF MEMS integrated passive device applications

P.J. de Veen, D.R. Hoogstede, C. Th. A. Revenberg et al. · Microelectronics Reliability · 2015 · 11 citations

Engineering, Advanced Packaging (Semiconductors), Medical Imaging +10