Mycronic (Sweden)

Through-Glass Vias for Glass Interposers and MEMS Packaging Applications Fabricated Using Magnetic Assembly of Microscale Metal Wires

Miku J. Laakso, Simon J. Bleiker, Jessica Liljeholm et al. · IEEE Access · 2018 · 38 citations · Full text

Engineering, Electrical Engineering, Materials Science +17

Inkjet printing technology for increasing the I/O density of 3D TSV interposers

Behnam Khorramdel, Jessica Liljeholm, Mika-Matti Laurila et al. · Microsystems & Nanoengineering · 2017 · 36 citations · Full text

Engineering, Materials Engineering, Materials Science +14

Cleanroom‐Free Direct Laser Micropatterning of Polymers for Organic Electrochemical Transistors in Logic Circuits and Glucose Biosensors

Alessandro Enrico, Sebastian Buchmann, Fabio De Ferrari et al. · Advanced Science · 2024 · 30 citations · Full text

Engineering, Bioengineering, Materials Engineering +16

Ultrahigh-energy-density supercapacitors based on all-pseudocapacitive binary metal sulfide–MXene composites

Asrar Alam, Keon‐Woo Kim, Hangjun Jo et al. · Journal of Materials Chemistry A · 2024 · 28 citations

Natural Sciences, Materials Engineering, Materials Science +17

A comparative life cycle assessment of stretchable and rigid electronics: a case study of cardiac monitoring devices

Samruddha Kokare, Farazee M.A. Asif, Gustaf Mårtensson et al. · International Journal of Environmental Science and Technology · 2021 · 19 citations · Full text

Engineering, Biomedical Engineering, Cardiology +17