Derek R. Braden

Microelectronic package characterisation using scanning acoustic microscopy

Guangming Zhang, David M. Harvey, Derek R. Braden · NDT & E International · 2007 · 58 citations

Materials Science, Engineering, Microfabrication +8

Advanced Acoustic Microimaging Using Sparse Signal Representation for the Evaluation of Microelectronic Packages

G.-M. Zhang, David M. Harvey, Derek R. Braden · IEEE Transactions on Advanced Packaging · 2006 · 31 citations

Engineering, Mechanical Engineering, Sparse Imaging +18

Signal denoising and ultrasonic flaw detection via overcomplete and sparse representations

Guangming Zhang, David M. Harvey, Derek R. Braden · The Journal of the Acoustical Society of America · 2008 · 28 citations

Engineering, Atomic Decomposition, Sparse Signal Representations +16

An automated ultrasonic inspection approach for flip chip solder joint assessment

Ryan S.H. Yang, Derek R. Braden, Guangming Zhang et al. · Microelectronics Reliability · 2012 · 21 citations

Engineering, Nondestructive Testing, Industrial Engineering +7

Through lifetime monitoring of solder joints using acoustic micro imaging

Ryan S.H. Yang, Derek R. Braden, Guang‐Ming Zhang et al. · Soldering and Surface Mount Technology · 2012 · 20 citations

Engineering, Well Diagnostics, Mechanical Engineering +16