Concepedia

Ryan S.H. Yang

RS

2

Publications

41

Citations

2

H-Index

2012

Active since

Affiliations

Liverpool John Moores University(Current)

Ryan S.H. Yang is an author at Liverpool John Moores University specializing in electronic packaging, instrumentation, and ultrasound.

Top concepts

UltrasoundEngineeringInstrumentationElectronic PackagingMechanical EngineeringStructural Health MonitoringMicrofabricationWell DiagnosticsCondition MonitoringElectrical Engineering

Publications per year

2012–2012

2

Publications

2

An automated ultrasonic inspection approach for flip chip solder joint assessment

Ryan S.H. Yang, Derek R. Braden, Guangming Zhang et al. · Microelectronics Reliability · 2012 · 21 citations

Engineering, Nondestructive Testing, Industrial Engineering +7

Through lifetime monitoring of solder joints using acoustic micro imaging

Ryan S.H. Yang, Derek R. Braden, Guang‐Ming Zhang et al. · Soldering and Surface Mount Technology · 2012 · 20 citations

Engineering, Well Diagnostics, Mechanical Engineering +16

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