Harry A. Schafft - Concepedia

Author

Harry A. Schafft

National Institute of Standards and Technology

Also Known As

H A Schafft, H. A. SCHAFFT, H. A. Schafft, H. Schafft, H.A. Schafft, Harry A Schafft, Harry A. Schafft, Harry Schafft, Schafft,H. A.

Publications

1.1K

Citations

H-Index

Concepts

All Affiliations

National Institute of Standards and Technology Intel (United States)George Washington University Infineon Technologies (Germany)

About

Harry A. Schafft is an author at National Institute of Standards and Technology specializing in engineering, electrical engineering, and electrical insulation.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	15	20	892
2	Social Sciences	2	2	45
3	Business	1	1	27
4	Education	1	1	77
5	Management	1	1	42

Harry A. Schafft

Publications

915

Citations

H-Index

Page 1

	Year	Citations
Thermal analysis of electromigration test structures Harry A. Schafft IEEE Transactions on Electron Devices EngineeringMechanical EngineeringInterconnect (Integrated Circuits)Electromigration CharacterizationsAccelerated Stress Tests	1987	170
Second breakdown—A comprehensive review Harry A. Schafft Proceedings of the IEEE ReliabilitySemiconductor DevicesElectrical EngineeringReliability EngineeringEngineering	1967	125
Reproducibility of electromigration measurements Harry A. Schafft, T.C. Staton, J. Mandel, IEEE Transactions on Electron Devices ElectrohydrodynamicsEngineeringMeasurementMechanical EngineeringEducation	1987	77
"Second breakdown" in transistors Harry A. Schafft, J.C. French IRE Transactions on Electron Devices Device ModelingElectrical EngineeringEngineeringPhysicsBias Temperature Instability	1962	66
Improved estimation of the resistivity of pure copper and electrical determination of thin copper film dimensions Constance E. Schuster, Márk Vangel, Harry A. Schafft Microelectronics Reliability Materials ScienceElectrical EngineeringEngineeringResistorSpecific Resistance	2001	62
The measurement, use and interpretation of the temperature coefficient of resistance of metallizations Harry A. Schafft, John S. Suehle Solid-State Electronics Materials ScienceEngineeringSpecific ResistanceCorrosionMechanical Engineering	1992	55
Thermal conductivity measurements of thin-film silicon dioxide Harry A. Schafft, John S. Suehle, P. Mirel Materials ScienceThin Film PhysicsHigh Temperature MaterialsEngineeringFilm Thickness	2003	47
A survey of second breakdown Harry A. Schafft, J.C. French IEEE Transactions on Electron Devices EngineeringPower ElectronicsReliability EngineeringElectronic EngineeringNew High-current Mode	1966	42
Modeling and simulation of resistivity of nanometer scale copper A. Emre Yarımbıyık, Harry A. Schafft, Richard A. Allen, Microelectronics Reliability Electrical EngineeringEngineeringResistorSpecific ResistanceNanotechnology	2005	40
Electromigration and the Current Density Dependence Harry A. Schafft, Tammy C. Grant, Atul Saxena, Reliability physics EngineeringMetallization ResistanceMechanical EngineeringCharge TransportEmpirical Expression	1985	33

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