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Reproducibility of electromigration measurements
77
Citations
13
References
1987
Year
ElectrohydrodynamicsEngineeringMeasurementMechanical EngineeringEducationTest MetallizationOven TemperatureCalibrationApplied MeasurementThermal AnalysisThermodynamicsElectronic PackagingInstrumentationReliabilityElectrical EngineeringElectromigration TechniquePhysicsNondestructive TestingElectromigration MeasurementsRadiometryMetallization TemperatureHigh Temperature MaterialsTemperature MeasurementElectrical Mobility
The reproducibility of median-time-to-failure (t <inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">50</inf> ) measurements was determined in an interlaboratory experiment in which 11 laboratories and a reference laboratory took part. Each laboratory used a method of its choosing to test equivalent samples under the same conditions of current density and oven temperature. The between-laboratory reproducibility of t <inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">50</inf> measurements normalized to one metallization temperature was dependent on current-density stress: at 1.0 MA /cm <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sup> it was within 15 percent, while at 2.5 MA/cm <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sup> it was generally within 50 percent. The primary source for variability is in estimating the temperature rise of the test metallization due to joule heating. Recommendations are given for the design and test of electromigration test structures to improve the reproducibility of t <inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">50</inf> measurements.
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