Yidnekachew S. Mekonnen

Embedded Multi-die Interconnect Bridge (EMIB) -- A High Density, High Bandwidth Packaging Interconnect

Ravi Mahajan, Robert Sankman, Neha Patel et al. · 2016 · 357 citations

Engineering, Computer Engineering, Electrical Engineering +17

Black-box modeling of passive systems by rational function approximation

Rong Gao, Yidnekachew S. Mekonnen, W.T. Beyene et al. · IEEE Transactions on Advanced Packaging · 2005 · 35 citations

Natural Sciences, Mathematics, Systems Engineering +16

Impact of Use Conditions on Dielectric and Conductor Material Models for High-Speed Package Interconnects

Cemil S. Geyik, Yidnekachew S. Mekonnen, Zhichao Zhang et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2019 · 24 citations

Natural Sciences, Electrical Engineering, Materials Science +17

Comparative Study of Convolution and Order Reduction Techniques for Blackbox Macromodeling Using Scattering Parameters

José E. Schutt‐Ainé, Patrick Goh, Yidnekachew S. Mekonnen et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2011 · 19 citations

Computing, Computational Engineering, Computational Electromagnetics +15

Acceleration of Spectral Domain Approach for Generalized Multilayered Shielded Microstrip Interconnects Using Two Fast Convergent Series

Sidharath Jain, Jiming Song, Telesphor Kamgaing et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2013 · 10 citations

Engineering, Computational Engineering, Electrical Engineering +17