S. Gale

Leading indicators-of-failure for prognosis of electronic and MEMS packaging

Pradeep Lall, Nokibul Islam, Kaysar Rahim et al. · 2004 · 68 citations

Engineering, Electrical Engineering, Materials Engineering +17

Damage mechanics of electronics on metal-backed substrates in harsh environments

Pradeep Lall, Nokibul Islam, T. Shete et al. · 2004 · 31 citations

Engineering, Materials Engineering, Materials Science +15

Lead-Free Chip Scale Packages: Assembly and Drop Test Reliability

Yi Liu, Guangming Tian, S. Gale et al. · IEEE Transactions on Electronics Packaging Manufacturing · 2006 · 29 citations

Engineering, Materials Engineering, Materials Science +10

Investigation of the Role of Void Formation at the Cu-to-Intermetallic Interface on Aged Drop Test Performance

Yueli Liu, S. Gale, R. Wayne Johnson · IEEE Transactions on Electronics Packaging Manufacturing · 2007 · 11 citations

Engineering, Materials Engineering, Materials Science +17