Concepedia
Statistics
Publications
3
Citations
38
H-Index
Active since
2002
Affiliations
Auburn University(Current)
Intel (United States)
R. Wayne Johnson is an author at Auburn University specializing in engineering, chip packaging, and materials science.
Publications per year
2002–2007
Double Bump Flip-Chip Assembly
Kanghong Yan, R. Wayne Johnson, Russell Stapleton et al. · IEEE Transactions on Electronics Packaging Manufacturing · 2006 · 14 citations
Engineering, Materials Engineering, Materials Science +13
Solder joint reliability of surface mount chip resistors/capacitors on insulated metal substrates
Jeffrey C. Suhling, R. Wayne Johnson, J. White et al. · 2002 · 13 citations
Engineering, Materials Engineering, Materials Science +17
Investigation of the Role of Void Formation at the Cu-to-Intermetallic Interface on Aged Drop Test Performance
Yueli Liu, S. Gale, R. Wayne Johnson · IEEE Transactions on Electronics Packaging Manufacturing · 2007 · 11 citations
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