Concepedia

K. Saijo

KS

Statistics

Publications

5

Citations

102

H-Index

5

Active since

2002

Affiliations

Toyo Kohan (Japan)(Current)

The University of Tokyo

K. Saijo is an author at Toyo Kohan (Japan) specializing in materials engineering, materials science, and natural sciences.

Publications per year

2002–2005

5

Publications

5

Surface activated bonding of LCP/Cu for electronic packaging

M.M.R. Howlader, Tadatomo Suga, Akio Takahashi et al. · Journal of Materials Science · 2005 · 34 citations

, , +12

Enhanced Cu/LCP adhesion by pre-sputter cleaning prior to Cu deposition

Matiar M. R. Howlader, M. K. P. Iwashita, K. Nanbu et al. · IEEE Transactions on Advanced Packaging · 2005 · 22 citations

, , +15

Low temperature bonded Cu/LCP materials for FPCs and their characteristics

K. Nanbu, S. Ozawa, Katsumi Yoshida et al. · IEEE Transactions on Components and Packaging Technologies · 2005 · 16 citations

, , +14

New fabrication technology of polymer/metal lamination and its application in electronic packaging

Tadatomo Suga, Akio Takahashi, K. Saijo et al. · 2002 · 16 citations

, , +15

A lamination technique of LCP/Cu for electronic packaging

Tadatomo Suga, Akio Takahashi, M.M.R. Howlader et al. · 2003 · 14 citations

, , +13

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