K. Samulewicz

Statistics

Publications

Citations

137

H-Index

Active since

2000

Affiliations

Fraunhofer Institute for Reliability and Microintegration(Current)

Technische Universität Berlin

K. Samulewicz is an author at Fraunhofer Institute for Reliability and Microintegration specializing in engineering, wafer-level packaging, and wafer bonding.

Publications per year

2000–2011

Publications

TSV based silicon interposer technology for wafer level fabrication of 3D SiP modules

Kai Zoschke, J.K. Wolf, Christina Lopper et al. · 2011 · 61 citations

Engineering, Computer Engineering, Electrical Engineering +17

Fab Integrated Packaging (FIP): a new concept for high reliability wafer-level chip size packaging

Michael J. Topper, J. Auersperg, V. Glaw et al. · 2000 · 40 citations

Engineering, Manufacturing Engineering, Microfabrication +14

Wafer Level Processing of Integrated Passive Components Using Polyimide or Polybenzoxazole/Copper Multilayer Technology

Kai Zoschke, Thorsten Fischer, Michael J. Topper et al. · IEEE Transactions on Advanced Packaging · 2010 · 20 citations

Engineering, Electrical Engineering, Materials Engineering +17

Wafer level package using double balls

Michael J. Topper, V. Glaw, P. Coskina et al. · 2002 · 16 citations

Engineering, Computer Engineering, Electronic Materials +15

1–4 of 4