Qiuxiao Qian

Statistics

Publications

Citations

H-Index

Active since

2006

Affiliations

Fairchild Semiconductor (United States)(Current)

Qiuxiao Qian is an author at Fairchild Semiconductor (United States) specializing in engineering, integrated circuit design, and simulation-based design.

Publications per year

2006–2012

Publications

Simulation and analysis for typical package assembly manufacture

Yong Liu, Scott Irving, D. Desbiens et al. · EuroSime 2006 - 7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems · 2006 · 14 citations

Engineering, Manufacturing Engineering, Finite Element Analysis +15

Modeling for critical design and performance of wafer level chip scale package

Yong Liu, Qiuxiao Qian, Matt Ring et al. · 2012 · 13 citations

Engineering, Materials Engineering, Materials Science +11

Board level drop impact simulation and test for development of wafer level chip scale package

Yong Liu, Qiuxiao Qian, Jihwan Kim et al. · 2010 · 12 citations

Engineering, Materials Science, Mechanical Behavior Of Materials +16

Systematic Evaluation of Die Thinning Application in a Power SIP by Simulation

Yong Liu, D. Desbiens, Scott Irving et al. · 2006 · 11 citations

Engineering, Electrical Engineering, Packaging Design +16

Wire bonding capillary profile and bonding process parameter optimization simulation

Qiuxiao Qian, Yong Liu, Timwah Luk et al. · 2008 · 11 citations

Engineering, Materials Engineering, Materials Science +17

1–5 of 5