Timwah Luk

Thermosonic Wire Bonding Process Simulation and Bond Pad Over Active Stress Analysis

Yong Liu, Scott Irving, Timwah Luk · IEEE Transactions on Electronics Packaging Manufacturing · 2008 · 82 citations

Engineering, Electrical Engineering, Materials Science +17

3D Modeling of electromigration combined with thermal–mechanical effect for IC device and package

Yong Liu, Lihua Liang, Scott Irving et al. · Microelectronics Reliability · 2008 · 80 citations

Engineering, Computer Engineering, Electrical Engineering +14

Experimental Determination and Modification of Anand Model Constants for Pb-Free Material 95.5Sn4.0Ag0.5Cu

Liang Lihua, Xuefan Chen, Weng Xiaohong et al. · 2007 · 58 citations

Natural Sciences, Materials Engineering, Materials Science +17

Trends of Power Electronic Packaging and Modeling

Yong Liu, Scott Irving, Timwah Luk et al. · 2008 · 50 citations

Engineering, Electrical Engineering, Materials Science +17

Modeling MOS snapback for circuit-level ESD simulation using BSIM3 and VBIC models

Yuanzhong Zhou, D. Connerney, R. Carroll et al. · 2005 · 30 citations

Engineering, Computer Engineering, Electrical Engineering +17