Scott Irving

Thermosonic Wire Bonding Process Simulation and Bond Pad Over Active Stress Analysis

Yong Liu, Scott Irving, Timwah Luk · IEEE Transactions on Electronics Packaging Manufacturing · 2008 · 82 citations

Engineering, Mechanical Engineering, Residual Stress +21

3D Modeling of electromigration combined with thermal–mechanical effect for IC device and package

Yong Liu, Lihua Liang, Scott Irving et al. · Microelectronics Reliability · 2008 · 80 citations

3D Ic Architecture, Electrical Engineering, Chip-scale Package +14

Experimental Determination and Modification of Anand Model Constants for Pb-Free Material 95.5Sn4.0Ag0.5Cu

Qiang Wang, Liang Lihua, Xuefan Chen et al. · 2007 · 58 citations

Engineering, Mechanical Engineering, Solid-state Chemistry +21

Free drop test simulation for portable IC package by implicit transient dynamics FEM

Scott Irving, Y. Liu · 2004 · 51 citations

Engineering, Computational Mechanics, Portable Ic Packages +22

Trends of Power Electronic Packaging and Modeling

Yong Liu, Scott Irving, Timwah Luk et al. · 2008 · 50 citations

Power Device Integration, Engineering, Power Devices +17