Yong Liu

3D Modeling of electromigration combined with thermal–mechanical effect for IC device and package

Yong Liu, Lihua Liang, Scott Irving et al. · Microelectronics Reliability · 2008 · 80 citations

3D Ic Architecture, Electrical Engineering, Chip-scale Package +14

The predicted rate-dependent deformation behaviour and multistage strain hardening in a model heterostructured body-centered cubic high entropy alloy

Jing Peng, Li Li, Fang Li et al. · International Journal of Plasticity · 2021 · 70 citations

Materials Science, Engineering, Severe Plastic Deformation +10

Micro wire electrode electrochemical cutting with low frequency and small amplitude tool vibration

Shaohua Wang, Di Zhu, Yongbin Zeng et al. · The International Journal of Advanced Manufacturing Technology · 2010 · 65 citations

Electrometallurgy, Micro Wire Electrode, Engineering +7

Micro electrochemical milling of complex structures by using in situ fabricated cylindrical electrode

Yong Liu, Di Zhu, Linsen Zhu · The International Journal of Advanced Manufacturing Technology · 2011 · 60 citations

Materials Science, Engineering, Complex Structures +9

Experimental Determination and Modification of Anand Model Constants for Pb-Free Material 95.5Sn4.0Ag0.5Cu

Qiang Wang, Liang Lihua, Xuefan Chen et al. · 2007 · 58 citations

Engineering, Mechanical Engineering, Solid-state Chemistry +21