D. Desbiens

Impact of the die attach process on power & thermal cycling for a discrete style semiconductor package

Yong Liu, Scott Irving, D. Desbiens et al. · 2005 · 21 citations

Engineering, Electrical Engineering, Materials Science +17

Methodology for Avoidance of Ratcheting-Induced Stable Cracking (RISC) in Microelectronic Devices

Zhen Zhang, Zhigang Suo, Yong Liu et al. · 2006 · 19 citations

Engineering, Materials Engineering, Materials Science +17

Simulation and analysis for typical package assembly manufacture

Yong Liu, Scott Irving, D. Desbiens et al. · EuroSime 2006 - 7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems · 2006 · 14 citations

Engineering, Manufacturing Engineering, Finite Element Analysis +15

Systematic Evaluation of Die Thinning Application in a Power SIP by Simulation

Yong Liu, D. Desbiens, Scott Irving et al. · 2006 · 11 citations

Engineering, Electrical Engineering, Packaging Design +16

Trends in power semiconductor packaging

D. Desbiens · 2005 · 11 citations

Engineering, Electrical Engineering, Materials Science +17