Hsiu-Chih Chen

Low-Temperature Microwave Annealing Processes for Future IC Fabrication—A Review

Yao‐Jen Lee, Ta-Chun Cho, Shang-Shiun Chuang et al. · IEEE Transactions on Electron Devices · 2014 · 81 citations

Engineering, Electrical Engineering, Materials Science +17

First selenide-centered CuI8 cubic clusters containing dialkyl diselenophosphate ligands. X-Ray structure of {Cu8(μ8-Se)[Se2P(OPri)2]6}

C. W. Liu, Hsiu-Chih Chen, C. W. Liu et al. · Chemical Communications · 1998 · 41 citations

Natural Sciences, Chemistry, Crystal Structure +13

High performance poly Si junctionless transistors with sub-5nm conformally doped layers by molecular monolayer doping and microwave incorporating CO2 laser annealing for 3D stacked ICs applications

Yao‐Jen Lee, Ta-Chun Cho, Po-Jung Sung et al. · 2015 · 32 citations

Engineering, Electrical Engineering, Materials Science +17

TSV-free FinFET-based Monolithic 3D⁺-IC with computing-in-memory SRAM cell for intelligent IoT devices

Fu-Kuo Hsueh, Hsiao-Yun Chiu, Chang‐Hong Shen et al. · 2017 · 30 citations

Engineering, Computer Engineering, Electrical Engineering +9

Negative-Capacitance FinFET Inverter, Ring Oscillator, SRAM Cell, and Ft

Kai‐Shin Li, Yun-Jie Wei, Yi‐Ju Chen et al. · 2018 · 28 citations

Engineering, Electrical Engineering, Materials Science +12