Brett Wilkerson

3D Packaging for Heterogeneous Integration

Rahul Agarwal, Patrick Cheng, Priyal Shah et al. · 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) · 2022 · 118 citations

Engineering, Computer Engineering, High-performance Computing +17

Surface and Buried Interfacial Structures of Epoxy Resins Used as Underfills Studied by Sum Frequency Generation Vibrational Spectroscopy

Anne V. Vázquez, B. Holden, Cornelius B. Kristalyn et al. · ACS Applied Materials & Interfaces · 2011 · 32 citations

Natural Sciences, Materials Engineering, Materials Science +17

AMD Instinct^TM MI250X Accelerator enabled by Elevated Fanout Bridge Advanced Packaging Architecture

Raja Swaminathan, Michael Schulte, Brett Wilkerson et al. · 2023 · 14 citations

Engineering, Computer Engineering, Computer Science +16

Global Optimization of Surface Warpage for Inverse Design of Ultra-Thin Electronic Packages Using Tensor Train Decomposition

Cheryl Selvanayagam, Pham Luu Trung Duong, Brett Wilkerson et al. · IEEE Access · 2022 · 10 citations · Full text

Engineering, Materials Engineering, Materials Science +14