AMD Instinct^TM MI250X Accelerator enabled by Elevated Fanout Bridge Advanced Packaging Architecture

Abstract

The recent advancement of leadership class supercomputers was enabled by Frontier, the world’s first Exascale supercomputer, leveraging AMD EPYC <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">TM</sup> CPU and AMD Instinct <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">TM</sup> GPU accelerators. Meeting the compute density and efficiency targets was beyond traditional Moore’s Law silicon scaling; accordingly, innovations in the AMD CDNA <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">TM</sup> architecture and design as well as packaging and platform architectures were required. AMD utilized an advanced packaging architecture known as Elevated Fanout Bridge (EFB) to fabricate the accelerator engine with integrated High Bandwidth Memory (HBM). EFB has proven to be a cost-effective and reliable packaging technology with the ability to meet the current performance requirements for HBM2e and to scale for future architectures.