Praneet Adusumilli

A 7nm FinFET technology featuring EUV patterning and dual strained high mobility channels

Ruijie Xie, P. Montanini, Kerem Akarvardar et al. · 2016 · 144 citations

Engineering, Electrical Engineering, Materials Science +15

Future on-chip interconnect metallization and electromigration

Chunhua Hu, James J. Kelly, Huai Huang et al. · 2018 · 70 citations

Engineering, Electrical Engineering, Materials Science +17

Confined PCM-based Analog Synaptic Devices offering Low Resistance-drift and 1000 Programmable States for Deep Learning

W. Kim, Robert L. Bruce, Takeshi Masuda et al. · 2019 · 70 citations

Engineering, Electrical Engineering, Materials Science +15

A Heterogeneous and Programmable Compute-In-Memory Accelerator Architecture for Analog-AI Using Dense 2-D Mesh

Shubham Jain, Hsinyu Tsai, Ching-Tzu Chen et al. · IEEE Transactions on Very Large Scale Integration (VLSI) Systems · 2022 · 70 citations

Computing, Computer Engineering, Computer Science +17

Tungsten and cobalt metallization: A material study for MOL local interconnects

V. Kamineni, M. Raymond, S. Siddiqui et al. · 2016 · 65 citations

Natural Sciences, Materials Engineering, Materials Science +17