Electrodeposition of CoWP film

Theoretical and experimental studies of multiple nucleation

B.R. Scharifker, Graham Hills · Electrochimica Acta · 1983 · 2.2K citations

Natural Sciences, Materials Science, Physics +11

Relationship between interfacial adhesion and electromigration in Cu metallization

Michael Lane, E. Liniger, J. R. Lloyd · Journal of Applied Physics · 2003 · 294 citations

Natural Sciences, Electrical Engineering, Materials Science +13

Copper Transport in Thermal SiO2

Yosi Shacham‐Diamand, A. Dedhia, D. Hoffstetter et al. · Journal of The Electrochemical Society · 1993 · 241 citations

Engineering, Materials Engineering, Materials Science +17

Electroless copper deposition for ULSI

Yosi Shacham‐Diamand, Valery M. Dubin, M. Angyal · Thin Solid Films · 1995 · 224 citations · Full text

Natural Sciences, Electrical Engineering, Materials Science +17

Electrochemical behaviour of cobalt in aqueous solutions of different pH

Waheed A. Badawy, F. Al-Kharafi, J. R. Al-Ajmi · Journal of Applied Electrochemistry · 2000 · 190 citations

Natural Sciences, Chemical Engineering, Chemistry +13