Electrical and mechanical reliability and failure mechanism analysis of electrically conductive adhesives

Solder joint fatigue models: review and applicability to chip scale packages

W.W Lee, Luu Nguyen, Guna S Selvaduray · Microelectronics Reliability · 2000 · 507 citations

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Recent advances in flexible sensors for wearable and implantable devices

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Engineering, Biomedical Engineering, Materials Science +17

Adhesion and durability of metal-polymer bonds

J. D. Venables · Journal of Materials Science · 1984 · 393 citations

Natural Sciences, Materials Engineering, Materials Science +12

Environmental Failure of Structural Adhesive Joints

R. A. Gledhill, A. J. Kinloch · The Journal of Adhesion · 1974 · 243 citations

Engineering, Materials Engineering, Materials Science +14

The effect of network structure on moisture absorption of epoxy resins

Y. Diamant, G. Marom, L. J. Broutman · Journal of Applied Polymer Science · 1981 · 227 citations

Natural Sciences, Materials Engineering, Materials Science +17