A Low-Cost On-Chip Substrate Integrated Plasmonic Waveguide Bandpass Filter for Millimeter-Wave Applications

Abstract

In this letter, a glass-based millimeter-wave (mm-W) bandpass filter (BPF) using substrate-integrated plasmonic waveguide (SIPW) is first proposed and demonstrated. The passband of BPF can be independently controlled by tuning the parameters of the substrate-integrated waveguide (SIW) width and the SIPW slot length. The proposed BPF is fabricated by wafer-level through glass via (TGV) technology. Compared with other integrated circuits (ICs) fabrication processes, wafer-level TGV technology is cost-effective and easy to mass production. The measured insertion loss at center frequency of the proposed BPF is 1.78 dB and the return loss is below −12 dB within the passband. Further, the size of the proposed BPF can be reduced by structure optimization, which enables it competitive for mm-W system.