Concepedia

Physics of failure based lifetime modelling for sintered silver die attach in power electronics: Accelerated stress testing by isothermal bending and thermal shock in comparison

Jens Heilmann, Bernhard Wunderle, Uwe Zschenderlein, Catharina Wille, K. Pressel

Microelectronics Reliability · 2023 · 26 citations · 18 references

DOI

Concepts

References

18

Description of Stress-Strain Curves by Three Parameters

Walter Ramberg, William R. Osgood · University of North Texas Digital Library (University of North Texas) · 1943 · 2.8K citations · Full text

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What is the Young's Modulus of Silicon?

Matthew A. Hopcroft, William D. Nix, Thomas W. Kenny · Journal of Microelectromechanical Systems · 2010 · 2K citations

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Linear Thermal Expansion Coefficient of Silicon from 293 to 1000 K

H. Watanabe, N. Yamada, Masahiro Okaji · International Journal of Thermophysics · 2004 · 425 citations

, , +12

Novel large area joining technique for improved power device performance

H. Schwarzbauer, R. Kuhnert · IEEE Transactions on Industry Applications · 1991 · 197 citations

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Identifying the Development State of Sintered Silver (Ag) as a Bonding Material in the Microelectronic Packaging Via a Patent Landscape Study

Kim S. Siow, Y. T. Lin · Journal of Electronic Packaging · 2016 · 149 citations

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