IEEE Electron Device Letters · 2022 · 26 citations · 29 references
EngineeringElectrical EngineeringElectronic MaterialsMicroelectronicsSemiconductor DevicesCarrier TransportDevice CharacterizationMetal-semiconductor ContactsSemiconductor ReliabilityWide Band Gap SemiconductorsTrapping Effects
A 600-V p-GaN gate HEMT with buried hole spreading channel (BHSC) is demonstrated to suppress the buffer trap related dynamic <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">${R}_{\text {ON}}$ </tex-math></inline-formula> degradation. The BHSC is located at the interface between u-GaN and buried AlGaN. In the on-state, the holes injected from the p-GaN gate can effectively spread along the BHSC and screen the negative buffer charges. The hole spreading effect is verified by a detection of hole current from the sidewall of BHSC. The screening effect is verified by a positive substrate stress test that intentionally induces severe buffer trapping, which is widely known to cause severe dynamic <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">${R}_{\text {ON}}$ </tex-math></inline-formula> degradation in traditional GaN HEMTs. However, the propose device exhibits an immunity against buffer trapping owing to the screening effect of the holes along BHSC. The dynamic performance with as short as <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$\sim 20~\mu \text{s}$ </tex-math></inline-formula> delay after a 400-V substrate stress is characterized. Nearly zero buffer trap related dynamic <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">${R}_{\text {ON}}$ </tex-math></inline-formula> degradation is achieved.
29
GaN-on-Si Power Technology: Devices and Applications
Kevin J. Chen, Oliver D. Häberlen, Alex Lidow et al. · IEEE Transactions on Electron Devices · 2017 · 1.6K citations
The 2018 GaN power electronics roadmap
Hiroshi Amano, Yannick Baines, Edward Beam et al. · Journal of Physics D Applied Physics · 2018 · 1.3K citations · Full text
30-W/mm GaN HEMTs by Field Plate Optimization
Yifeng Wu, A. Saxler, M. Moore et al. · IEEE Electron Device Letters · 2004 · 1.1K citations