Interfacial structures and mechanical properties of Cu/Sn/Cu containing SiC nanowires under transient liquid phase bonding

Kinetic analysis of the soldering reaction between eutectic SnPb alloy and Cu accompanied by ripening

H. K. Kim, K. N. Tu · Physical review. B, Condensed matter · 1996 · 501 citations

Engineering, Materials Engineering, Materials Science +14

Interfacial reaction in Cu/Sn/Cu system during the transient liquid phase soldering process

Jianfeng Li, Pearl Agyakwa, C. Mark Johnson · Acta Materialia · 2010 · 398 citations

Engineering, Materials Engineering, Materials Science +16

Kinetic theory of flux-driven ripening

Andriy Gusak, K. N. Tu · Physical review. B, Condensed matter · 2002 · 227 citations

Natural Sciences, Physics, Chemical Kinetics +12

Microstructure evolution and grain orientation of IMC in Cu-Sn TLP bonding solder joints

Lei Sun, Minghe Chen, Liang Zhang · Journal of Alloys and Compounds · 2019 · 170 citations

Natural Sciences, Materials Engineering, Materials Science +17

Growth kinetics of Cu6Sn5 intermetallic compound at liquid-solid interfaces in Cu/Sn/Cu interconnects under temperature gradient

Ning Zhao, Yi Zhong, Mingliang Huang et al. · Scientific Reports · 2015 · 149 citations · Full text

Engineering, Materials Engineering, Materials Science +17