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Revealing the relationship between grain size and corrosion rate of metals

K.D. Ralston, N. Birbilis, C.H.J. Davies · Scripta Materialia · 2010 · 1.1K citations

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New lead-free, Sn-Zn-In solder alloys

M. McCormack, S. Jin, H. S. Chen et al. · Journal of Electronic Materials · 1994 · 148 citations

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Investigation of interfacial microstructure and wetting property of newly developed Sn–Zn–Cu solders with Cu substrate

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Enhancement of creep resistance and thermal behavior of eutectic Sn–Cu lead-free solder alloy by Ag and In-additions

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