IEEE Electromagnetic Compatibility Magazine · 2016 · 13 citations · 19 references
EngineeringComputer EngineeringElectrical EngineeringMicroelectronicsSemiconductor DevicesSystem-on-chip DesignDevice ModelingElectromagnetic CompatibilityIntegrated Circuit DesignIntegrated Circuit DevicesSignal IntegrityVery-large-scale Integration Layout3D Integrated CircuitsElectromagnetic InterferenceElectromagnetic Interference MitigationParasitic EffectsPower IntegrityThree-dimensional Integrated Circuit LayoutThree-dimensional IntegrationThrough-silicon Via Design
This second part addresses a selection of topics related to Electromagnetic interference (EMI) issues in three-dimensional integrated components. Details about Through Silicon Via TSV) technology, modelling and parasitic effects are introduced in the first part, then key concepts such as signal integrity (SI), power integrity (PI), and Electromagnetic Interference are introduced.
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Modeling and Analysis of Through-Silicon Via (TSV) Noise Coupling and Suppression Using a Guard Ring
Jonghyun Cho, Eakhwan Song, Ki-Hyun Yoon et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2011 · 166 citations
Engineering, Computer Engineering, Electrical Engineering +17