Foundry Perspectives on 2.5D/3D Integration and Roadmap

Abstract

Chiplets integration technology supports Moore's law sustaining. A disruptive system integration technology platform (3DFabric™) is established to achieve the goal. There is a big room to scale up 2.5D system envelope and scale down 3D bonding pitch to provide higher system values on performance, power efficiency, bandwidth, latency and heat dissipation. Based on our proposed 3D interconnect scaling roadmap, energy efficient performance (EEP) can be scaled 2X from-node-to-node by a 70% SoIC bonding pitch scaling each node. By leveraging the platform, we can also integrate critical passives including system cooling module and Si Photonics into the heterogeneous system to further enhance these values.