Douglas Yu - Concepedia

Author

Douglas Yu

Taiwan Semiconductor Manufacturing Company (Taiwan)

Also Known As

C.H. Tsai, Douglas C. H. Yu, Douglas C.-H. Yu, Douglas C.H. Yu, Douglas Chen-Hua Yu, Douglas Yu

Publications

1.7K

Citations

H-Index

Concepts

All Affiliations

Taiwan Semiconductor Manufacturing Company (Taiwan)Taiwan Semiconductor Manufacturing Company (United States)

About

Douglas Yu is an author at Taiwan Semiconductor Manufacturing Company (Taiwan) specializing in computer engineering, engineering, and microelectronics.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	21	29	1.5K
2	Applied Physics	8	8	320
3	Business	1	1	15
4	Education	1	1	17
5	Natural Sciences	1	1	64

Douglas Yu

Publications

1.6K

Citations

H-Index

Page 1

	Year	Citations
InFO (Wafer Level Integrated Fan-Out) Technology Chien-Fu Tseng, Chung-Shi Liu, Chi-Hsi Wu, System On ChipElectrical EngineeringChip-scale PackageEngineeringSmart Mobile Devices	2016	270
Wafer-Level Integration of an Advanced Logic-Memory System Through the Second-Generation CoWoS Technology S. Y. Hou, W. Chris Chen, Clark Hu, IEEE Transactions on Electron Devices EngineeringVlsi DesignDevice IntegrationComputer ArchitectureEye Diagram	2017	202
High-performance integrated fan-out wafer level packaging (InFO-WLP): Technology and system integration Christianto C. Liu, Shuo-Mao Chen, Feng-Wei Kuo, EngineeringRadio FrequencyIntegrated CircuitsPower ElectronicsSystem Integration	2012	125
Wafer Level System Integration of the Fifth Generation CoWoS®-S with High Performance Si Interposer at 2500 mm2 P. K. Huang, Chin‐Wei Lu, Wen-En Wei, Artificial IntelligenceEngineeringDevice IntegrationComputer ArchitectureIntegrated Circuits	2021	79
Ultra High Density SoIC with Sub-micron Bond Pitch Y. H. Chen, Chi‐Ming Yang, Chih-Ting Kuo, EngineeringDevice IntegrationIntegrated CircuitsUltrahigh Density 3DInterconnect (Integrated Circuits)	2020	64
InFO_AiP Technology for High Performance and Compact 5G Millimeter Wave System Integration Chuei-Tang Wang, Tzu-Chun Tang, Chun-Wen Lin, Wireless CommunicationsInfo TechnologyMillimeter Wave TechnologyEngineering5G System	2018	63
A new integration technology platform: Integrated fan-out wafer-level-packaging for mobile applications Douglas Yu EngineeringDevice IntegrationComputer ArchitectureMobile Product RequirementsHardware Architecture	2015	60
SoIC for Low-Temperature, Multi-Layer 3D Memory Integration M. F. Chen, C. S. Lin, E.B. Liao, Memory Cube IntegrationEngineeringComputer ArchitectureInterconnect (Integrated Circuits)Multi-channel Memory Architecture	2020	48
Low Temperature SoIC Bonding and Stacking Technology for 12-/16-Hi High Bandwidth Memory (HBM) M. F. Chen, Chung-Hao Tsai, Terry Ku, IEEE Transactions on Electron Devices EngineeringMemory DesignEmerging Memory TechnologyComputer ArchitectureDaisy Chains	2020	44
InFO_SoW (System-on-Wafer) for High Performance Computing Shu-Rong Chun, Tin-Hao Kuo, Hao-Yi Tsai, Info TechnologyEngineeringInfo_sow Structural RobustnessEnergy EfficiencyComputer Architecture	2020	42

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