Douglas Yu

InFO (Wafer Level Integrated Fan-Out) Technology

Chien-Fu Tseng, Chung-Shi Liu, Chi-Hsi Wu et al. · 2016 · 270 citations

System On Chip, Electrical Engineering, Chip-scale Package +14

Wafer-Level Integration of an Advanced Logic-Memory System Through the Second-Generation CoWoS Technology

S. Y. Hou, W. Chris Chen, Clark Hu et al. · IEEE Transactions on Electron Devices · 2017 · 202 citations

Engineering, Vlsi Design, Device Integration +23

High-performance integrated fan-out wafer level packaging (InFO-WLP): Technology and system integration

Christianto C. Liu, Shuo-Mao Chen, Feng-Wei Kuo et al. · 2012 · 125 citations

Engineering, Radio Frequency, Integrated Circuits +16

Wafer Level System Integration of the Fifth Generation CoWoS®-S with High Performance Si Interposer at 2500 mm2

P. K. Huang, Chin‐Wei Lu, Wen-En Wei et al. · 2021 · 79 citations

Artificial Intelligence, Engineering, Device Integration +18

Ultra High Density SoIC with Sub-micron Bond Pitch

Y. H. Chen, Chi‐Ming Yang, Chih-Ting Kuo et al. · 2020 · 64 citations

Engineering, Device Integration, Integrated Circuits +24