Chuei-Tang Wang - Concepedia

Author

Chuei-Tang Wang

Taiwan Semiconductor Manufacturing Company (Taiwan)

Also Known As

Chuei-Tang Wang

Publications

487

Citations

H-Index

Concepts

All Affiliations

Taiwan Semiconductor Manufacturing Company (Taiwan)

About

Chuei-Tang Wang is an author at Taiwan Semiconductor Manufacturing Company (Taiwan) specializing in engineering, microelectronics, and computer engineering.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	11	11	448
2	Computer Engineering	8	8	372
3	Applied Physics	2	2	35
4	Computer Science	2	2	67
5	Natural Sciences	1	1	12

Chuei-Tang Wang

Publications

459

Citations

H-Index

Page 1

	Year	Citations
High-performance integrated fan-out wafer level packaging (InFO-WLP): Technology and system integration Christianto C. Liu, Shuo-Mao Chen, Feng-Wei Kuo, EngineeringRadio FrequencyIntegrated CircuitsPower ElectronicsSystem Integration	2012	125
InFO_AiP Technology for High Performance and Compact 5G Millimeter Wave System Integration Chuei-Tang Wang, Tzu-Chun Tang, Chun-Wen Lin, Wireless CommunicationsInfo TechnologyMillimeter Wave TechnologyEngineering5G System	2018	63
Array antenna integrated fan-out wafer level packaging (InFO-WLP) for millimeter wave system applications Chung-Hao Tsai, Jeng-Shien Hsieh, Monsen Liu, Chip-scale PackageEngineeringAdvanced Packaging (Semiconductors)Millimeter Wave TechnologyMicrowave Transmission	2013	45
InFO_SoW (System-on-Wafer) for High Performance Computing Shu-Rong Chun, Tin-Hao Kuo, Hao-Yi Tsai, Info TechnologyEngineeringInfo_sow Structural RobustnessEnergy EfficiencyComputer Architecture	2020	42
Signal and Power Integrity Analysis on Integrated Fan-Out PoP (InFO_PoP) Technology for Next Generation Mobile Applications Chuei-Tang Wang, Douglas Yu Electrical EngineeringChip-scale PackageEngineeringAdvanced Packaging (Semiconductors)Info_pop Technology	2016	38
Foundry Perspectives on 2.5D/3D Integration and Roadmap Douglas Yu, Chuei-Tang Wang, Harry Hsia 2021 IEEE International Electron Devices Meeting (IEDM) EngineeringDevice IntegrationElectronic Design AutomationComputer ArchitectureComputer-aided Design	2021	35
Signal Integrity of Submicron InFO Heterogeneous Integration for High Performance Computing Applications Chuei-Tang Wang, Jeng-Shien Hsieh, Victor C. Y. Chang, Artificial IntelligenceHeterogeneous ComputingEngineeringVlsi DesignComputer Architecture	2019	25
Ultra High Density Low Temperature SoIC with Sub-0.5 μm Bond Pitch Han-Jong Chia, Shih-Peng Tai, Ji James Cui, EngineeringVlsi DesignComputer ArchitecturePhysical Design (Electronics)Advanced Packaging (Semiconductors)	2023	23
High Performance Chip-Partitioned Millimeter Wave Passive Devices on Smooth and Fine Pitch InFO RDL Che‐Wei Hsu, Chung-Hao Tsai, Jeng-Shien Hsieh, Electrical EngineeringMillimeter Wave TechnologyEngineeringAdvanced Packaging (Semiconductors)Radio Frequency	2017	21
High performance passive devices for millimeter wave system integration on integrated fan-out (InFO) wafer level packaging technology Chung-Hao Tsai, Jeng-Shien Hsieh, Wei-Heng Lin, EngineeringRadio FrequencyDevice IntegrationInterconnect (Integrated Circuits)Electromagnetic Compatibility	2015	19

Page 1