High quality full ablation cutting and stealth dicing of silica glass using picosecond laser Bessel beam with burst mode

All-organic active matrix flexible display

Lisong Zhou, Alfred Wanga, Sheng-Chu Wu et al. · Applied Physics Letters · 2006 · 594 citations

Optical Materials, Engineering, Organic Electronics +19

High aspect ratio nanochannel machining using single shot femtosecond Bessel beams

M. K. Bhuyan, François Courvoisier, P.-A. Lacourt et al. · Applied Physics Letters · 2010 · 362 citations · Full text

Engineering, Laser Science, Target Fabrication +21

High quality quasi-Bessel beam generated by round-tip axicon

Oto Brzobohatý, Tomáš Čižmár, Pavel Zemánek · Optics Express · 2008 · 327 citations · Full text

Engineering, Physics, Microscopy +14

Investigation on glass/epoxy composite surfaces machined by abrasive water jet machining

Amimul Ahsan · Journal of Materials Processing Technology · 2007 · 175 citations

Materials Science, Engineering, Material Machining +7

Advanced Dicing Technology for Semiconductor Wafer—Stealth Dicing

Masayoshi Kumagai, Naoki Uchiyama, Etusji Ohmura et al. · IEEE Transactions on Semiconductor Manufacturing · 2007 · 171 citations

Engineering, Wafer Scale Processing, Advanced Packaging (Semiconductors) +16