Effect of addition of Al and Cu on the properties of Sn–20Bi solder alloy

Low melting point solders based on Sn, Bi, and In elements

Yingxia Liu, K. N. Tu · Materials Today Advances · 2020 · 240 citations · Full text

Natural Sciences, Materials Engineering, Materials Science +16

Interfacial reactions between molten Sn–Bi–X solders and Cu substrates for liquid solder interconnects

Jianfeng Li, S.H. Mannan, M.P. Clode et al. · Acta Materialia · 2006 · 227 citations

Natural Sciences, Materials Engineering, Materials Science +16

Elastic modulus, hardness and creep performance of SnBi alloys using nanoindentation

Pradita Septiwerdani, Zhong Chen · Materials Science and Engineering A · 2012 · 165 citations

Natural Sciences, Materials Engineering, Materials Science +14

The properties of Sn-9Zn lead-free solder alloys doped with trace rare earth elements

Chi‐Man Lawrence Wu, Daquan Yu, C. Law et al. · Journal of Electronic Materials · 2002 · 123 citations

Natural Sciences, Materials Engineering, Materials Science +10

Thermal and mechanical properties of Sn–Zn–Bi lead-free solder alloys

A.A. El-Daly, Y. Swilem, M.H. Makled et al. · Journal of Alloys and Compounds · 2009 · 110 citations

Natural Sciences, Materials Engineering, Materials Science +12