Cu-Cu joint formation by low-temperature sintering of self-reducible Cu nanoparticle paste under ambient condition

Joining of Silver Nanomaterials at Low Temperatures: Processes, Properties, and Applications

Peng Peng, Anming Hu, A.P. Gerlich et al. · ACS Applied Materials & Interfaces · 2015 · 358 citations

Natural Sciences, Materials Engineering, Materials Science +17

Review of silver nanoparticle based die attach materials for high power/temperature applications

Seyed Amir Paknejad, S.H. Mannan · Microelectronics Reliability · 2017 · 231 citations

Natural Sciences, Materials Engineering, Materials Science +11

Highly Conductive Cu–Cu Joint Formation by Low-Temperature Sintering of Formic Acid-Treated Cu Nanoparticles

Jingdong Liu, Hongtao Chen, Hongjun Ji et al. · ACS Applied Materials & Interfaces · 2016 · 223 citations

Natural Sciences, Materials Engineering, Materials Science +17

Self-reduction of a copper complex MOD ink for inkjet printing conductive patterns on plastics

Yousef Farraj, Michael Grouchko, Shlomo Magdassi · Chemical Communications · 2014 · 184 citations

Natural Sciences, Materials Engineering, Materials Science +17

High-Temperature Operation of SiC Power Devices by Low-Temperature Sintered Silver Die-Attachment

Jian Yin, Zhiye Zhang, Guo‐Quan Lu et al. · IEEE Transactions on Advanced Packaging · 2007 · 174 citations

Engineering, Electrical Engineering, Materials Engineering +15