2020 · 105 citations · 5 references
ComputingComputer ScienceComputer VisionMachine VisionSensorsDigital Image ProcessingGraphics Processing UnitsImage ProcessingMotion AnalysisMotion SensorsHigh-speed ReadoutLow-power Motion SensingMotion Artifact DetectionMotion ArtifactsPixel PitchPower ConsumptionPower Consumption ModelingPower Consumption Optimization
This paper reports a 1280×960 DVS. A 4.95-μm pixel pitch is achieved with in-pixel Cu-Cu connection and the newly designed GIDL-suppression scheme. A sequential column selection scheme and a global event-holding function are implemented to minimize motion artifacts. The power consumption per pixel of 122 nW is 1.25× smaller and the maximum readout speed of 1.3 Geps is 4.33× faster than the previous state-of-the-art.
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Novel stacked CMOS image sensor with advanced Cu2Cu hybrid bonding
Y. Kagawa, Nobutoshi Fujii, Kenichi Aoyagi et al. · 2016 · 234 citations