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Athermal and thermal coupling electromigration effects on the microstructure and failure mechanism in advanced fine-pitch Cu interconnects under extremely high current density

Materials EngineeringMaterials ScienceElectrical EngineeringElectromigration TechniqueEngineeringAdvanced Packaging (Semiconductors)Wafer Scale ProcessingNanoelectronicsApplied PhysicsHigh Current DensityChip AttachmentFailure MechanismElectromigration EffectsElectronic PackagingMicroelectronicsInterconnect (Integrated Circuits)Electrical Insulation