Design Optimization of Pillar Bump Structure for Minimizing the Stress in Brittle Low K Dielectric Material Layer

Thermal characterization of an epoxy-based underfill material for flip chip packaging

Brian E Moreira, Alan Overson, Stacy H Nakamura et al. · Thermochimica Acta · 2000 · 103 citations

Engineering, Materials Engineering, Materials Science +13

Cu pillar bumps as a lead-free drop-in replacement for solder-bumped, flip-chip interconnects

B. Ebersberger, Charles Lee · 2008 · 51 citations

Engineering, Electrical Engineering, Materials Engineering +16

Encapsulant for fatigue life enhancement of controlled-collapse chip connection (C4)

D.W. Wang, K. I. Papathomas · IEEE Transactions on Components Hybrids and Manufacturing Technology · 1993 · 48 citations

Engineering, Materials Engineering, Materials Science +17

Investigation of Cu/Low-K Film Delamination in Flip-Chip Packages

Charlie Jun Zhai, U. Ozkan, A. DubeySidharth et al. · 2006 · 45 citations

Engineering, Materials Engineering, Materials Science +17

Studies on a novel flip-chip interconnect structure. Pillar bump

Tengfei Wang, Fletcher Tung, L. Foo et al. · 2002 · 44 citations

Engineering, Materials Engineering, Materials Science +15