Statistics
Publications
2
Citations
58
H-Index
2
Active since
2002
L. Foo is an author specializing in chip packaging, manufacturing processes, and engineering.
Publications per year
2002–2002
2
2
Studies on a novel flip-chip interconnect structure. Pillar bump
Tengfei Wang, Fletcher Tung, L. Foo et al. · 2002 · 44 citations
Assessment of flip chip assembly and reliability via reflowable underfill
Tie Wang, T.H. Chew, Christopher W. Lum et al. · 2002 · 14 citations
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